Infineon ARM Cortex M0, XMC1000 Microcontroller, 64-Pin VQFN

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小計 10 件 (按連續帶提供)*

HK$234.00

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包裝方式:
RS庫存編號:
258-1741P
製造零件編號:
XMC1403Q064X0200AAXUMA1
製造商:
Infineon
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品牌

Infineon

Family Name

XMC1000

Package Type

VQFN

Mounting Type

Surface Mount

Pin Count

64

Device Core

ARM Cortex M0

Infineon Microcontroller, 64 Pin Count, Surface Mount Package - XMC1403Q064X0200AAXUMA1


This cable tie bundling tool is a bench-mounted device designed for efficient bundling of cables up to 20mm in diameter. Made from durable aluminium, it weighs 10.1kg, ensuring stability during operation. This autotool streamlines the cable management process and is particularly useful in an industrial setting.

Features & Benefits


• Heavy-duty construction ensures long-lasting durability

• Ergonomic design reduces operator fatigue during use

• Foot switch operation allows hands-free functioning

• Tool mount secures the autotool for stable use

• Integrated waste bin design simplifies waste disposal

• Automatic tying mechanism enhances work efficiency

Applications


• Used for automatic bundling of cables in industrial settings

• Ideal for installation in workbenches or assembly lines

• Suitable for electrical and mechanical requiring cable management

• Frequently Effective in automation and electronics industries

How does the ergonomic design improve productivity during operations?


The ergonomic design allows users to operate the tool comfortably over extended periods, reducing strain on hands and wrists, which enhances overall workplace productivity.

What maintenance is required to keep the tool in optimal condition?


Regular cleaning of the tool and workspace is necessary to prevent material buildup and ensure smooth operation. Additionally, checking the electrical connections and components for damage is advised for safety and functionality.

Can the tool be operated with various types of cable ties?


While specifically designed for standard cable ties, it is recommended to use compatible materials to ensure efficient operation and avoid jamming during bundling.