TE Connectivity AMPMODU System 50 Series Right Angle Board PCB Header, 30 Contact(s), 1.27 mm Pitch, 2 Row, Unshrouded

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小計(1 管,共 30 件)*

HK$2,043.57

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  • 2026年1月28日 發貨
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RS庫存編號:
505-972
製造零件編號:
5-103911-7
製造商:
TE Connectivity
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品牌

TE Connectivity

Product Type

PCB Header

Series

AMPMODU System 50

Pitch

1.27mm

Current

3.6A

Housing Material

Liquid Crystal Polymer

Number of Contacts

30

Number of Rows

2

Orientation

Right Angle

Shrouded/Unshrouded

Unshrouded

Connector System

Board-to-Board

Mount Type

Board

Contact Plating

Gold

Contact Material

Copper Alloy

Minimum Operating Temperature

65°C

Row Pitch

1.27mm

Termination Type

Solder

Maximum Operating Temperature

105°C

Tail Pin Length

2.54mm

Standards/Approvals

CSA LR7189, UL, UL 94V-0, UL E28476

Voltage

30 V

COO (Country of Origin):
MX
The TE Connectivity PCB Mount Receptacle is a cutting-edge solution designed for seamless integration in various electronic applications. Engineered with a right-angle orientation, this receptacle ensures optimal space utilisation on printed circuit boards while maintaining excellent signal integrity. With a robust 30-position configuration, it facilitates reliable board-to-board connections using the AMPMODU System 50. The solder-through hole design allows for lasting connections and durable performance, essential for modern electronic systems. Crafted from high-quality materials, it withstands harsh operating conditions, ensuring that your devices function effectively in demanding environments. This receptacle not only meets stringent industry standards but is also compliant with various environmental regulations, making it a sustainable choice for your projects.

Designed for optimal space utilisation with a right-angle PCB mount

Utilises the trusted AMPMODU System 50 for reliable performance

Offers a 30-position configuration for versatile applications

Built for durability, ensuring longevity even in harsh conditions

Compliant with industry standards, assuring quality and safety

Facilitates easy installation with a solder-through hole termination method

Features a liquid crystal polymer housing for enhanced resistance

Maximises signal integrity in various electronic applications

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