TE Connectivity 350787-1 Series Vertical Board PCB Header, 2 Contact(s), 6.35 mm Pitch, 1 Row, Shrouded
- RS庫存編號:
- 795-226
- 製造零件編號:
- 350787-1
- 製造商:
- TE Connectivity
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- RS庫存編號:
- 795-226
- 製造零件編號:
- 350787-1
- 製造商:
- TE Connectivity
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透過選取一個或多個屬性來查找類似產品。
選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | TE Connectivity | |
| Product Type | PCB Header | |
| Series | 350787-1 | |
| Current | 12A | |
| Pitch | 6.35mm | |
| Number of Contacts | 2 | |
| Housing Material | Nylon | |
| Number of Rows | 1 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Board | |
| Connector System | Wire-to-Board | |
| Contact Plating | Gold | |
| Contact Material | Phosphor Bronze | |
| Termination Type | Solder | |
| Row Pitch | 6.35mm | |
| Minimum Operating Temperature | -40°C | |
| Contact Gender | Female | |
| Maximum Operating Temperature | 105°C | |
| Tail Pin Length | 5.09mm | |
| Standards/Approvals | VDE | |
| Voltage | 600V | |
| 選取全部 | ||
|---|---|---|
品牌 TE Connectivity | ||
Product Type PCB Header | ||
Series 350787-1 | ||
Current 12A | ||
Pitch 6.35mm | ||
Number of Contacts 2 | ||
Housing Material Nylon | ||
Number of Rows 1 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Board | ||
Connector System Wire-to-Board | ||
Contact Plating Gold | ||
Contact Material Phosphor Bronze | ||
Termination Type Solder | ||
Row Pitch 6.35mm | ||
Minimum Operating Temperature -40°C | ||
Contact Gender Female | ||
Maximum Operating Temperature 105°C | ||
Tail Pin Length 5.09mm | ||
Standards/Approvals VDE | ||
Voltage 600V | ||
- COO (Country of Origin):
- CN
The TE Connectivity Wire to board connector is designed for secure and efficient electrical connections in Compact spaces, facilitating reliable power supply across various applications.
Compact design ensures optimal space utilisation
Durable construction provides enhanced reliability in harsh environments
Easy assembly with clear contact insertions
Compatible with 24-16 AWG wire range for versatility
Engineered with Advanced keying mechanisms to prevent mismating
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