TE Connectivity 7-51 Series Vertical Through Hole PCB Header, 80 Contact(s), 0.8 mm Pitch, 2 Row, Unshrouded
- RS庫存編號:
- 795-495
- 製造零件編號:
- 7-5179180-3
- 製造商:
- TE Connectivity
N
小計（1 卷，共 500 件）*
HK$35,439.63
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卷 | 每卷 | 每單位* |
|---|---|---|
| 1 + | HK$35,439.63 | HK$70.879 |
* 參考價格
- RS庫存編號:
- 795-495
- 製造零件編號:
- 7-5179180-3
- 製造商:
- TE Connectivity
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選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | TE Connectivity | |
| Product Type | PCB Header | |
| Series | 7-51 | |
| Pitch | 0.8mm | |
| Current | 0.5A | |
| Housing Material | Thermoplastic | |
| Number of Contacts | 80 | |
| Number of Rows | 2 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Unshrouded | |
| Connector System | Board-to-Board | |
| Mount Type | Through Hole | |
| Contact Material | Copper Alloy | |
| Contact Plating | Gold | |
| Minimum Operating Temperature | -40°C | |
| Row Pitch | 0.8mm | |
| Termination Type | Solder | |
| Contact Gender | Female | |
| Maximum Operating Temperature | 125°C | |
| Standards/Approvals | VDE | |
| Voltage | 100V | |
| 選取全部 | ||
|---|---|---|
品牌 TE Connectivity | ||
Product Type PCB Header | ||
Series 7-51 | ||
Pitch 0.8mm | ||
Current 0.5A | ||
Housing Material Thermoplastic | ||
Number of Contacts 80 | ||
Number of Rows 2 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Unshrouded | ||
Connector System Board-to-Board | ||
Mount Type Through Hole | ||
Contact Material Copper Alloy | ||
Contact Plating Gold | ||
Minimum Operating Temperature -40°C | ||
Row Pitch 0.8mm | ||
Termination Type Solder | ||
Contact Gender Female | ||
Maximum Operating Temperature 125°C | ||
Standards/Approvals VDE | ||
Voltage 100V | ||
- COO (Country of Origin):
- CN
The TE Connectivity high-performance vertical connector is designed for parallel board-to-board applications. Its reliable design facilitates efficient electrical connections, making it Ideal for Compact electronic assemblies.
Constructed with high-temperature thermoplastic, ensuring durability and longevity
Duplex plated contacts provide excellent electrical performance and minimised resistance
Available in various stacking heights for versatility in different applications
Supports high-density packaging with a 0.8mm centreline spacing
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