Molex SL Series Vertical Through Hole PCB Header, 5 Contact(s), 2.54 mm Pitch, 1 Row, Shrouded

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包裝方式:
RS庫存編號:
679-2480
Distrelec 貨號:
304-43-658
製造零件編號:
70543-0004
製造商:
Molex
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品牌

Molex

Product Type

PCB Header

Series

SL

Current

3A

Pitch

2.54mm

Number of Contacts

5

Housing Material

Glass Filled Polyester

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Connector System

Wire-to-Board

Mount Type

Through Hole

Contact Plating

Gold

Contact Material

Brass, Phosphor Bronze

Termination Type

Solder

Row Pitch

2.54mm

Minimum Operating Temperature

-40°C

Tail Pin Length

3.3mm

Maximum Operating Temperature

105°C

Contact Gender

Male

Mating Pin Length

6.1mm

Standards/Approvals

No

Voltage

250 V

Molex Series SL PCB Header, 3A Current Rating, 2.54mm Pitch - 70543-0004


This PCB header is designed for reliable connections in electronic circuits. Its shrouded configuration ensures secure contacts, making it valuable for high-performance applications. With a pitch of 2.54mm, this connector provides compatibility with various devices, streamlining assembly in automation, electrical, and mechanical industries.

Features & Benefits


• Gold plating on contacts enhances conductivity and durability

• Tin plating on PC tail ensures compatibility with lead-free soldering

• Suitable for wire to board applications, allowing flexibility in designs

Applications


• Used for signal connections in control systems

• Ideal for interconnecting PCBs in consumer electronics

• Employed in automation equipment for dependable performance

• Utilised in robotics for effective signal transmission

What is the maximum voltage rating supported?


The maximum voltage rating is 250V, accommodating a broad range of applications.

How many cycles can be expected from mate-unmate operations?


The product is rated for up to 50 mating cycles, ensuring long-term usability under standard conditions.

What type of soldering process is recommended for installation?


It is compatible with lead-free soldering processes, specifically suitable for wave soldering techniques for through-hole connections.

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