TE Connectivity Xplained Pro Temperature Development Board for TSYS01 Xplained Pro Systems

N
可享批量折扣
查看批量定價選項

小計(1 包,共 8 件)*

HK$1,862.872

Add to Basket
選擇或輸入數量
製造商存貨
  • 準備從 2026年7月06日 起發貨
**需要更多嗎?**輸入您需要的數量,然後按一下「查看送貨日期」以查詢更多庫存和送貨詳細資訊。

單位
每單位
每包*
8 - 32HK$232.859HK$1,862.87
40 +HK$228.205HK$1,825.64

* 參考價格

RS庫存編號:
678-276
製造零件編號:
DPP201A000
製造商:
TE Connectivity
透過選取一個或多個屬性來查找類似產品。
選取全部

品牌

TE Connectivity

Product Type

Sensor Development Tool

Sensor Technology

Temperature

Featured Device

TSYS01

For Use With

Xplained Pro Systems

Kit Classification

Development Board

Standards/Approvals

RoHS Compliant

Kit Name

Xplained Pro

COO (Country of Origin):
CN
The TE Connectivity Xplained Pro Board is a development and evaluation module designed for temperature sensing applications. It integrates the TSYS01 digital temperature sensor with the Xplained Pro platform, offering a convenient way to evaluate sensor performance and Interface with microcontroller development boards. This module is Ideal for Rapid prototyping, system integration, and educational use in embedded systems and IoT projects.

I2C communication Interface

Compact form factor

RoHS compliant

相关链接

第一時間了解我們的最新產品和優惠

電郵

您在訂閱此郵件時提供的個人信息將根據《隱私政策》進行處理。