Infineon HEXFET N-Channel MOSFET, 63 A, 100 V Enhancement TO-252 IRLR3110ZTRPBF

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HK$80.90

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包裝方式:
RS庫存編號:
257-9453
製造零件編號:
IRLR3110ZTRPBF
製造商:
Infineon
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品牌

Infineon

Channel Type

N

Product Type

MOSFET

Maximum Continuous Drain Current Id

63A

Maximum Drain Source Voltage Vds

100V

Package Type

TO-252

Series

HEXFET

Mount Type

Through Hole

Maximum Drain Source Resistance Rds

16mΩ

Channel Mode

Enhancement

Forward Voltage Vf

1.3V

Minimum Operating Temperature

-55°C

Maximum Operating Temperature

+175°C

Standards/Approvals

RoHS

Automotive Standard

No

Infineon HEXFET Series MOSFET, 100V Maximum Drain‑Source Voltage, 63A Maximum Continuous Drain Current - IRLR3110ZTRPBF


This MOSFET is a through‑hole power transistor designed for switching and power‑management roles in circuits requiring high current handling and elevated temperature endurance. It operates as an N‑channel enhancement device rated for medium‑voltage applications and is intended for installations where a TO‑252 package and straightforward PCB mounting are preferred.

Features and Benefits:


• 16mΩ Rds(on) reduces conduction losses during high current flow
• 100V Vds supports medium‑voltage switching applications
• 63A continuous drain current enables sustained heavy‑load operation
• -55°C to +175°C temperature range permits high‑temperature deployment
• 1.3V forward gate voltage allows efficient gate‑drive performance

Applications


• Suitable for DC power conversion stages in industrial equipment
• Ideal for motor‑drive switching in Compact assemblies
• Used with power supplies requiring high current throughput
• Can be used for battery management in high‑load systems
• Appropriate for thermal‑stress testing fixtures and rigs

What package type does it use for board mounting?


It is supplied in a TO‑252 package configured for through‑hole mounting, facilitating mechanical stability and heat dissipation.

What channel behaviour should designers expect?


It functions as an enhancement‑mode N‑channel transistor, requiring a positive gate‑to‑source drive for conduction.

How does temperature capability affect deployment?


The device is specified to operate across a -55°C to +175°C span, allowing use in environments with substantial thermal variation.

Is this component suitable for automotive‑standard projects?


The part is not designated to automotive standards and should not be assumed to meet those specific qualification criteria.

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