BGAP2S30AE6327XTSA1 Infineon Pre-Driver for Wireless Infrastructure Applications 35 dB, 16-Pin 4200MHz TSNP-16
- RS庫存編號:
- 349-420
- 製造零件編號:
- BGAP2S30AE6327XTSA1
- 製造商:
- Infineon
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單位 | 每單位 | 節省 |
|---|---|---|
| 1 - 9 | HK$65.50 | - |
| 10 - 99 | HK$59.00 | HK$65.00 |
| 100 - 499 | HK$54.30 | HK$1,120.00 |
| 500 - 999 | HK$50.50 | HK$7,500.00 |
| 1000 + | HK$45.20 | HK$20,300.00 |
* 參考價格
- RS庫存編號:
- 349-420
- 製造零件編號:
- BGAP2S30AE6327XTSA1
- 製造商:
- Infineon
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選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Infineon | |
| Product Type | Pre-Driver for Wireless Infrastructure Applications | |
| Technology | BiCMOS | |
| Gain | 35dB | |
| Package Type | TSNP-16 | |
| Minimum Supply Voltage | 4.75V | |
| Maximum Supply Voltage | 5.5V | |
| Pin Count | 16 | |
| Minimum Operating Temperature | -40°C | |
| Third Order Intercept OIP3 | 34.1dBm | |
| Noise Figure | 3.7dB | |
| Maximum Operating Temperature | 115°C | |
| Standards/Approvals | RoHS, JEDEC47/20/22 | |
| Height | 8mm | |
| Automotive Standard | No | |
| 選取全部 | ||
|---|---|---|
品牌 Infineon | ||
Product Type Pre-Driver for Wireless Infrastructure Applications | ||
Technology BiCMOS | ||
Gain 35dB | ||
Package Type TSNP-16 | ||
Minimum Supply Voltage 4.75V | ||
Maximum Supply Voltage 5.5V | ||
Pin Count 16 | ||
Minimum Operating Temperature -40°C | ||
Third Order Intercept OIP3 34.1dBm | ||
Noise Figure 3.7dB | ||
Maximum Operating Temperature 115°C | ||
Standards/Approvals RoHS, JEDEC47/20/22 | ||
Height 8mm | ||
Automotive Standard No | ||
- COO (Country of Origin):
- MY
The Infineon 3.3 to 4.2 GHz mid band driver amplifier that can be used as pre driver or driver in RF applications from massive MIMO 5G base stations to small cells and access points. The driver amplifier is typically placed between transceiver IC and power amplifier but can also be used as power amplifier for low power applications. The input and outputs are single-ended and internally matched to 50 Ω.
BiCMOS technology for an optimized performance
High gain and high power for fewer components in line up
Internal matching and saving external matching components
Easy design in and small area footprint
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